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    技術服務

    Design services

    來源: 發布時間:2016/4/15 16:21:48 瀏覽次數:0

       

    HuaTian Package Design Team has totel 15 members, all have rich experience that can help customers determine the optimum package for complex integrated circuits, assist customers in designing a package substrate to meet the customer's power, ground and I/O requirements for each pin and conduct thermal and electrical simulations.

        Package Design Team services include:

    ?  Customer-centric design.

    ?  High quality, reliable, and cost effective packaging proposal.

    ?  DFM (Design For Manufacturing) and DFC (Design for Cost).

    ?  Supporting auto- check of design and Drawings.

    Design Capabilities:

       Multi-Chip ModulesMCM

       System-in-Package (SiP)

       Flip Chip Package

       Hybrid Package

       Package-in-Package (PiP)

       Package-on-Package (PoP)

       Embedded Package

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